LMC6482 Dual CMOS Op Amps and I-V Modules

LMC6482 dual CMOS amplifiers: IC packages and a photodiode I-V module

This collection centers on LMC6482 dual operational-amplifier ICs, with selected DIP-8, SOIC/SOP-8 and compact eight-lead surface-mount offerings. It also includes an assembled LMC6482-labelled photodiode current-to-voltage module. Many existing multi-model product pages have LMC6482 as one option among unrelated semiconductors. A few pages in this collection do not offer an LMC6482 choice at all. Select the actual device, suffix, physical package and quantity before ordering. A collection label or keyword in a long product title does not override the selected variant.

What matters in a dual rail-to-rail CMOS amplifier

Listings describe LMC6482 as a two-circuit CMOS op amp with rail-to-rail input and output behavior. Rail-to-rail input addresses the usable input common-mode range; rail-to-rail output concerns achievable voltage swing toward the supply rails at a specified load. Neither means inputs may exceed the absolute maximum ratings nor that output reaches the exact supply rails at arbitrary current. The useful range depends on the exact suffix, supply voltage, temperature, load and gain. Compare the manufacturer's specifications for the selected device, especially when a sensor signal approaches either rail or a single-supply circuit needs a DC bias.

High input impedance is attractive for sensors, photodiodes and other sources that should not be heavily loaded, but it does not guarantee an accurate high-impedance measurement by itself. Board leakage, contamination, humidity, bias-current variation, shielding and guarding may dominate tiny currents. In a conventional voltage amplifier, determine input common-mode and differential limits, input bias and offset relative to source impedance, output swing at the actual load, noise in the relevant band, gain-bandwidth and phase margin. Check power-supply decoupling, startup and device thermal limits in the exact host design. Seller fields marked “standard,” “new original” or “international standard” are not numerical voltage or temperature ratings.

Choose the mechanical package, not just the part family

LMC6482AIM / AIMX and LMC6482IM / IMX appear on SOIC-8 or SOP-8-labelled listings; other pages separately offer LMC6482AIN / IN as DIP-8 through-hole options. A surface-mount SOIC body cannot be installed as a native DIP merely because both have eight leads. Compact LMC6482IMM / IMMX pages describe VSSOP-8 or MSOP-8-style formats, including a page selecting AIMX, IMX or IMMX individually. These compact footprints must not be mistaken for a full-size SOIC-8. One listing uses the text “LMC6482IMMX /NOPB” across several part names; do not assume /NOPB, reel form, marking or grade is guaranteed for every selected choice. Verify the actual suffix and manufacturer's package drawing, then match land pattern, pitch, body width and pin 1 orientation.

Some product titles combine LMC6482 with LMC6082. In one page the Model Number selector explicitly offers LMC6082 or LMC6482 with a separate 10/50/100-piece quantity selector; another 20-piece page has the same family distinction. A selected LMC6082 is not an LMC6482. Compare electrical specifications and stability instead of inferring direct interchangeability from a shared eight-pin package or similar LMC name. Another listing has “LMC6482IMMX” in the headline but a fixed ten-piece or five-piece choice; inspect each offer's quantity and package before comparing prices.

Pack sizes and mixed-part menus

LMC6482AIM-only selections occur as single units and packs such as 5, 10, 20, 50, 100 and, on a particular listing, 500; another DIP-8 LMC6482AIN page offers 5, 10, 20, 50 or 100 pieces. These are alternative quantities, not additive contents. Other listings encode part number and pack count together in a Color selector, for example “1PCS LMC6482AIM,” “5PCS LMC6482AIM” or “20PCS LMC6482AIM.” A listing selecting 1, 10 or 100 LMC6482IN chips in the same menu as TDA8566Q, AP3843GM-E1, FT2925P, AN34043AA or TC4010BP provides only the selected model and count. In high-mix menus, later variants often omit a package string that is present on an earlier variant, so do not assume every count has independently confirmed identical packaging without checking the offer.

Examples of other selected devices on these pages include LNK304DG and LNK623DG power-conversion ICs; LM555/LMC555 timers; LM4250, LM301, LM741, LM833, LMC662, LM6172 and TS912 analog ICs; OPA690 high-speed amplifier; AD633 analog multiplier; MC34063 and MP1584/MP2380 power-management devices; REF195 reference; MAX6675 interface IC; HEF4069, TC4066, TC4010, SN74HC138, 74HC238 and CD74HC670 logic; HCNW3120 optocoupled gate driver; BSS123 and other transistors; TDA8566Q and TAS5624A power-amplifier devices; and a variety of controllers, memory chips, RF/network ICs and rectifiers. None inherits LMC6482 pinout or performance by being listed nearby. One L6563 power-management product has only quantity choices and no LMC6482 option despite membership here. Do not choose any page solely by the collection name.

Photodiode current-to-voltage module: resistor choice changes the application

An LMC6482-labelled transimpedance amplifier module is offered for photodiode I-V conversion. Its Color selector lists 1K, 10K, 100K, 1M, 10M, 100M, 1G and 10G. These appear to represent feedback-resistance choices, not colors or a multi-resistor kit. Confirm the unit, populated feedback network and board schematic for the selected option before connecting a sensor. In a basic transimpedance stage the output magnitude scales approximately with photocurrent multiplied by feedback resistance until limited by offset, leakage, output headroom, bandwidth or stability. A 10G-ohm option is not intrinsically “more accurate”: tiny parasitic leakage and bias currents can produce large voltage errors, and high resistance plus photodiode capacitance may require compensation and have much narrower usable bandwidth.

The module seller quotes a 1.3 V/µs slew rate, typical/max offset values around +0.11/+0.75 mV, input-bias figures of ±0.02 pA typical and ±4 pA maximum, a “+1.5 V to +7.5 V” supply line with “+8 V maximum,” a quiescent-consumption line written “≤ ±15 mA,” and a “1.5M” gain-bandwidth line. These are unverified seller statements with incomplete measurement conditions and, in places, ambiguous sign or units. They must not be applied to every loose LMC6482 IC, every populated board configuration or a different package; the stated GBW is not the usable photodiode-system bandwidth. Verify which terminals are supply, input, reference and output on the delivered board, and verify whether the quoted supply is for the board or underlying IC. Avoid assuming a photodiode, enclosure, precision reference or calibrated instrument is included when the selected product is described as a module only.

Application-specific engineering checks

1. For precision DC: estimate offset, drift, input bias times source impedance and amplifier output headroom at the lowest supply and worst-case load. Include sensor tolerance and ADC reference error.
2. For photodiodes: identify expected dark and illuminated current range, junction capacitance, polarity, reverse bias, feedback resistance and compensation capacitance. Evaluate output saturation and settling after light steps.
3. For single-supply signals: check the full input common-mode excursion and output load rather than inferring true 0-to-VCC performance from the phrase “rail-to-rail.” An AC signal crossing below ground needs an appropriate signal reference, not just a rail-to-rail label.
4. For part substitutions: compare supply, speed, noise, bias, offset, load drive, pinout and physical footprint. A timer, regulator or power driver in a mixed menu is not a replacement for an amplifier.
5. For sourcing: verify part marking and traceability when necessary. Seller claims such as “original,” “RoHS compliant,” stock availability or broad certification are not evidence of lot-specific authenticity or compliance without supporting documentation.

Frequently asked questions

Does every page in this collection sell LMC6482? No. Some mixed menus include an LMC6482 option among other devices, while at least one power-management page has no LMC6482 choice. Read the selector.

Are DIP-8, SOIC-8 and VSSOP/MSOP-8 interchangeable on the PCB? No. They have different footprints and assembly methods. Match the selected suffix to the board land pattern and drawing.

Is LMC6082 the same as LMC6482? No. Listings expose them as separate model choices; evaluate their individual specifications before substitution.

Does rail-to-rail mean the output always reaches the supply rails exactly? No. Headroom depends on output current, load and stated conditions. Input range and output swing are separate limits.

Does the I-V module's “10G” selection make it suitable for any photodiode? No. Feedback resistance must be selected against current range, leakage, noise, capacitance, stability and required bandwidth.

Do the module's quoted supply, bias and 1.5M bandwidth figures apply to all LMC6482 chips here? No. Those are seller statements attached to one module listing, with incomplete test conditions; consult exact chip documentation and board schematic.

Does a multi-model title mean all chips are included? No. It usually lists alternative options. A model-and-count choice determines the shipped part and quantity.

Yoeruyo retains the existing assortment while distinguishing loose dual op amps, a populated transimpedance module and unrelated components. Confirm the precise selected option and verify it in your actual circuit before deployment.