151 ° C/303.8 ° F New Solder Paste, No Need for Cleaning, Solder Repair and Maintenance, Lead-Free Solder Paste Flux, 10g/35g/55

151 ° C/303.8 ° F New Solder Paste, No Need for Cleaning, Solder Repair and Maintenance, Lead-Free Solder Paste Flux, 10g/35g/55

$92.64

$92.64 $0.00

Color 55g-1PC-putter-2015 55g-1PC-flux 55g-1PC 35g-1PC-putter-2015 35g-1PC-flux 35g-2PC 35g-1PC 10g-2PC 10g-1PC

Description

SPECIFICATIONS

Alloy(HXP-602): Sn64.7Bi35Ag0.3

Brand Name: NONE

Choice: yes

Does the product contain Bi？: Yes

High-concerned chemical: none

Ingredient (HP-2015): all copper

Ingredient (HXP-901): Rosin hydrogenated(44%),Solvent(44%),1H-Benzotriazole.Adipic acid(12%)

Model Number: HXP-602

Origin: Mainland China

Particle Size: 20-38μm

Scope of Application: Maintenance of LED bead mounting, SMT mounting, and PCB mounting

melting point: 151℃/303.8°F

semi_Choice: yes

602: (Sn64.7Bi35Ag0.3) Composition: Tin (Sn) 56.73%, Bismuth (Bi) 31%, Silver (Ag) 0.27%, Melting Point: 151 ° C/303.8 ° F
HP-2015: All Copper
Flux: (melting point: 172 ° C (average temperature type), suitable for SMT process, in compliance with ROHS environmental standards.
Applicable fields: mobile phone and computer maintenance, LED packaging integrated circuits, BGA surface mount, etc.
Please note when using:
When using a hot air gun or soldering gun for heating, the temperature must be higher than the melting point of the product. Heat will be lost during the heating process, and the solder paste will fully melt to achieve the best effect.
If you encounter any problems during use, you can contact the customer service of the store.