Description

SPECIFICATIONS

Brand Name: FEHONDA

Breakdown Voltage: >6 KV/mm

Choice: yes

Density (±0.3): 2.9±0.2 g/cm³

Dimensions: 100*100mm,100*50mm

Hardness: 20-45 Shore C

High-concerned chemical: none

Material: Thermal,others

Model Number: Thermal Pad

Origin: Mainland China

Thermal Conductivity: 6,6W/mk

Thermal Pad Application: GPU/CPU/PC/Video card/laptop/other electronic equipment

Thermal Pad Material: Silicone,TIM

Thermal Pad Thickness: 0.5/0.75/1.0/1.25/1.5/1.75/2.0/2.25/2.5/2.75/3.0mm

Thickness: 1

Type: Thermal Pad

semi_Choice: yes

FEHONDA Thermal Pad (6W/m.K) – High-Performance Thermal Material

FEHONDA thermal pad is a premium heat-conducting filling material, integrating excellent insulation, compressibility, flexibility, and thermal conductivity. It’s engineered to meet the miniaturization and ultra-thinness design requirements of modern devices, delivering reliable heat dissipation for various electronic components.

- ✅6W/m.K Reliable Thermal Conductivity: Ensures efficient heat transfer between heat sources and radiators, effectively reducing component temperature.
- ✅ 13 Thickness Options: Covers 0.5mm to 4.0mm, perfectly matching different gap requirements of electronic devices, no need for custom thickness for most scenarios.

- ✅ Natural Surface Adhesion: Sticks firmly without extra glue, fills gaps tightly, squeezes out air between heat sources and radiators for full contact, maximizing heat transfer efficiency.

- ✅ Multi-Functional Protection: Besides heat conduction, it provides insulation and shock absorption, protecting delicate components from damage and short circuits.

- ✅ Flexible & Easy to Install: Soft and compressible texture adapts to uneven surfaces, simplifying assembly and fitting seamlessly into compact device structures.