Description

SPECIFICATIONS

Brand Name: FEHONDA

Breakdown Voltage: 9 KV/mm

Choice: yes

Density (±0.3): 3.4±0.2 g/cm³

Dimensions: 100*100mm,85*45mm

Hardness: 30-45 Shore C

High-concerned chemical: none

Material: Thermal,others

Model Number: 8w/12.8w/15w

Origin: Mainland China

Thermal Conductivity: 15,8W/12.8W/15W/mk

Thermal Pad Application: GPU/CPU/PC/Video card/laptop/other electronic equipment

Thermal Pad Material: Silicone,TIM

Thermal Pad Thickness: 0.5/0.75/1.0/1.25/1.5/1.75/2.0/2.25/2.5/2.75/3.0mm

Thickness: 1

Type: Thermal Pad

semi_Choice: yes

Why FEHONDA Thermal Pad Is a Top Choice for Heat Dissipation?

FEHONDA thermal pad belongs to the FHD universal thermal pad series, engineered as a high-performance heat conductive solution for electronic devices. This flexible thermal pad combines excellent insulation, compressibility, and softness with outstanding thermal conductivity—addressing the heat management needs of modern compact electronics. With its natural surface adhesion, it effectively fills gaps between heat sources and radiators,push air to achieve full contact, ensuring efficient heat transfer while providing insulation and shock absorption. It’s the ideal thermal filling material for device miniaturization and ultra-thin design requirements.

Advantages of Our Thermal Pads

✅ Multi-Specification Options: Choose from 3 thermal conductivity levels and 11 thicknesses to match your specific device requirements—no need to compromise on performance or fit.
✅ Excellent Thermal Conductivity: Even the entry-level 8W/m.K thermal pad delivers efficient heat transfer, while the 15W/m.K version handles high-heat components with ease.
✅ Natural Surface Adhesion: The self-adhesive thermal pad eliminates the need for additional glue, simplifying installation. It fills gaps tightly to squeeze out air, maximizing heat contact area.
✅ Insulation & Shock Absorption: Beyond heat dissipation, this thermal pad acts as an electrical insulator and shock absorber, protecting delicate components from damage and short circuits.
✅ Flexible & Compressible: Soft and compressible design adapts to uneven surfaces, ensuring consistent performance even in complex device structures. Meets the needs of miniaturized and ultra-thin device designs.

Wide Applications of FEHONDA Thermal Pad

This versatile thermal pad is widely used in various electronic components and devices, including but not limited to:

Consumer electronics: Laptops, smartphones, game consoles, tablets, LED TVs
Power devices: Voltage regulators, power amplifiers, MOSFETs, IGBT modules
Industrial equipment: Industrial control motherboards, inverters, PLCs
Communication devices: Routers, base stations, network switches
Other electronic products requiring efficient heat dissipation and gap filling

How to Use FEHONDA Thermal Pad

Clean the surfaces of the heat source (e.g., CPU, GPU) and radiator to remove dust, oil, or old thermal material.
Select the appropriate thermal pad specification (conductivity & thickness) based on your device’s gap and heat load.
Peel off the protective film from the self-adhesive side of the thermal pad.
Apply the thermal pad to the heat source, then press the radiator firmly onto it to ensure full contact.
No curing time required—devices can be used immediately after installation.