SPECIFICATIONS

Brand Name: icepc

Choice: yes

High-concerned chemical: none

Material: others

Model Number: SM

Origin: Mainland China

RGB Support: NO RGB

Thermal Conductivity: 400

Thickness: 0.15

Type: Thermal Pad

semi_Choice: yes

Product Features:

1. High Thermal Conductivity

Thermal conductivity reaches 400–500 W/(m·K), 2–3 times that of copper and 3–5 times that of aluminum. Rapidly converts point heat sources into surface heat sources, enhancing heat dissipation efficiency.

2. Ultra-Thin and Ultra-Lightweight Design

Extremely thin material thickness with a density only 1/4 to 1/10 that of copper and 1/1.3 to 1/3 that of aluminum. Lightweight and slim without adding burden to equipment, suitable for precision electronic products.

3. High Temperature Resistance and Low Thermal Resistance

Excellent high-temperature resistance and low thermal resistance enable stable operation in high-temperature environments, ensuring long-term safe equipment operation.

4. Flexible and Processable

The material is pliable, allowing repeated bending. It facilitates cutting, stamping, and composite processing, accommodating diverse structural and shape requirements for easy installation.

5. Wide Range of Applications

Suitable for smartphones, laptops, LEDs, optical modules, digital cameras, power batteries, and various smart electronic devices, making it an ideal thermal management material.

Specification:

1. Material: Graphene

2. Thermal Conductivity: 400–500 W/m·K

3. Properties: High-temperature resistance, Low thermal resistance

NOTE:

1.The size is measured by hand, there may be 0-3mm error, which is normal.

2.Due to the difference between different monitors, the picture color may be a little deviation from the actual color of the item.

Package list:

Graphene Heat Dissipation Pad