MECHANIC 183℃ Solder Tin Paste Sn63/Pb37 BGA Reballing Welding Flux Soldering Cream for Mobile Phone IC CPU SMD PCB Rework Tools
XGSP40
$20.04
Sale price
$20.04
Regular price
$0.00
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MECHANIC 183℃ Solder Tin Paste Sn63/Pb37 BGA Reballing Welding Flux Soldering Cream for Mobile Phone IC CPU SMD PCB Rework Tools
$20.04
Sale price
$20.04
Regular price
$0.00
Description
SPECIFICATIONS
Brand Name: MECHANIC
Certification: NONE
Choice: yes
Does the product contain Bi？: No
Gross Weight: 20g/35g/42g/60g
High-concerned chemical: none
Ingredients: Sn63/Pb37
Melting Point: 183℃
Model Number: XGZ40/XGSP30/XGSP40/XGSP50/XGSP80
Origin: Mainland China
Particle Size: 20-38μm
Usage: BGA Soldering Tools
MECHANIC 183℃ Solder Tin Paste Sn63/Pb37 BGA Reballing Welding Flux Soldering Cream for Mobile Phone IC CPU SMD PCB Rework Tools
Specification :
--Brand : MECHANIC.
--Model : XGZ40/XGSP30/XGSP40/XGSP50/XGSP80.
--Type : Tin Paste .
--Weight : 20g/35g/42g/60g.
--Microns : 20-38um.
--Melting Point : 183℃.
--Great Soldering Rework Tools for Smart Phone, PCB, BGA, Motherboard Repairing.
--WARNING: This product can expose you to chemicals including lead, which is known to the State of California to cause cancer and birth defects or other reproductive harm. For more information go towww.P65Warnings.ca.gov.
Package :
1 * Solder Tin Paste
Free Shipping Over $199
- Standard Shipping: Standard Shipping (12–18 Business Days)
- Express Shipping: Expedited Shipping (5–9 Business Days)
- Free Shipping: Orders over $199 qualify automatically
- Tracking: Full tracking number provided for all orders
30-Day Return Policy
- Returns: 30-day hassle-free return window
- Condition: Items must be unused and in original packaging
- Refund: Full refund processed within 3-5 business days
Why Choose Us?
- Factory Direct: ISO/TS 16949 certified manufacturer
- Quality: 100% electrical continuity tested before shipment
- Experience: 15+ years in automotive connector industry
- Support: Professional technical support available
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