Nc-559-asm Flux Bga Balls,Liquid Solder for Soldering Syringe Solder Paste 10ml Flux for Soldering No Cleaning Welding Tools

Nc-559-asm Flux Bga Balls,Liquid Solder for Soldering Syringe Solder Paste 10ml Flux for Soldering No Cleaning Welding Tools

$12.36

$12.36 $0.00

Color DSUNYK 1 DSUNYK 2

Weight 2PCS 1PCS 10PCS 5PCS

Description

SPECIFICATIONS

Brand Name: DSUNYK

Certification: REACH,RoHS

Choice: yes

High-concerned chemical: none

Incompatible materials: Strong oxidants, acids, anhydrides, alkali metals, amines.

Main application: Surface welding aid for tin lead or tin silver copper alloys

Model Number: NC-559-ASM

Origin: Mainland China

Particle Size: 10-25μm

additive: <5%

rosin: 40-50 %

solvent: <30 %

surfactant: <5%,<3%

synthetic resin: <10 %

thixotropic agent: <5 %

DSUNYK Nc-559-asm Flux Bga Balls,Liquid Solder for Soldering Syringe Solder Paste 10ml Flux for Soldering No cleaning Welding Tools

Item Specific:
Capacity: 10ML

Brand :DSUNYK

Model: NC-559-ASM
Color: As shown
Suitable for BGA ball, semiconductor packaging, repair.
Computer motherboard north and south bridge, communications,
graphics and other BGA apply.

Features:
1: This product is no-clean solder paste, very little residue, without washing.
2: The residue is colorless and transparent appearance outstanding.
3: Excellent printing performance with suitable hand and machine print.

Is currently the best on the market BGA, CSP rework help paste.
Just apply a little each time
When the bumping of the BGA chip coated with flux paste and PCB pads are required coat,
Good BGA soldering flux paste and machine regardless of manual welding,
the success rate is greatly increased.

Nc-559-asm
Liquid Solder for Soldering
Syringe Solder Paste
Bga Balls
Flux for Soldering
Welding Tools

DSUNYK Nc-559-asm Flux Bga Balls,Liquid Solder for Soldering Syringe Solder Paste 10ml Flux for Soldering No cleaning Welding Tools

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