SPECIFICATIONS

Parameter Category

Detailed Specifications

Full Model

H9TQ64A8GTCCUR-KUM

Product Type

eMCP (Embedded Multi-Chip Package) - Memory + Flash 2-in-1 Package

Memory Section (LPDDR3 SDRAM)

- Storage Capacity

8Gb (1GB)

- Memory Type

LPDDR3 SDRAM (Low Power DDR3)

- Bus Width

x32 (32-bit)

- Organization

256M x 32

- Interface Speed

1866 Mbps (MT/s)

- Core Voltage

1.2V (VDD1) / 1.8V (VDD2)

- Refresh Cycle

64ms @ 25°C

Flash Section (eMMC NAND)

- Storage Capacity

8GB (MLC NAND Flash)

- Flash Type

Compliant with eMMC 5.1 Standard (backward compatible with eMMC 4.5/5.0)

- Bus Width

x8 (8-bit Data Bus)

- Maximum Transfer Rate

400MB/s (HS400 Mode)

- Operating Clock

0–200MHz (HS400 Mode); up to 52MHz in Boot Mode

- Supported Bus Widths

1-bit, 4-bit, 8-bit (configurable)

Physical Characteristics

- Package Type

FBGA-221 (221-Ball Fine Pitch Ball Grid Array)

- Package Dimensions

11.5mm × 13.0mm × 1.0mm (1.0t thickness, 0.5mm ball pitch)

- Lead-Free / Environmental Compliance

RoHS-compliant, lead-free and halogen-free process

Electrical Characteristics

- Operating Voltage

1.8V (VCC) / 1.2V (VCCQ for LPDDR3) / 1.8V (VCCQ for eMMC)

- Standby Power Consumption

Low-power design with support for multi-level power-saving modes

Operating Environment

- Operating Temperature Range

Commercial Grade: 0°C ~ +85°C

- Storage Temperature Range

-40°C ~ +95°C

Application Scenarios

Smartphones, tablets, in-vehicle infotainment systems, industrial embedded devices, IoT terminals

Suffix Description

KUM: Standard commercial-grade package with lead-free process, compliant with industry-standard compatibility requirements