SPECIFICATIONS

Applicable Scenarios 1: PCB, Circuit Board, Motherboard, Mobile Phone, Laptop, Tablet, Computer, Camera, Game Console, Electronic Device, Digital Product

Applicable Scenarios 2: SMD, SMT, BGA, IC Chip, LED, CPU, GPU, Resistor, Capacitor, Connector, Sensor, Diode, Transistor, Micro Component, Fine Pitch Component

Applicable Scenarios 3: Phone Repair, Laptop Repair, Motherboard Repair, Circuit Board Repair, BGA Rework, Chip Repair, Electronics Maintenance, DIY Electronics, Factory Assembly, Prototype Production

Applicable Scenarios 4: Repair Shop, Electronics Workshop, SMT Factory, PCB Factory, Laboratory, School, Home Repair, Industrial Repair, Maintenance Center, Electronic Assembly Line

Brand Name: NONE

Certification: RoHs,CE,RoHS,REACH

Choice: yes

Composition 1: Sn96.5Ag3.0Cu0.5, SAC305, Tin 96.5%, Silver 3.0%, Copper 0.5%, Lead-Free Tin Silver Copper Alloy

Composition 2: Sn99Ag0.3Cu0.7, SAC0307, Tin 99%, Silver 0.3%, Copper 0.7%, Lead-Free Tin Silver Copper Alloy

Does the product contain Bi？: No

Feature 1: Lead-Free, No-Clean, Easy to Use, Smooth Paste, Good Wetting, Stable Soldering, Strong Adhesion, High Reliability, Clean Solder Joint

Feature 10: Solder Paste Welding Tin, SAC305 Solder Paste, SAC0307 Solder Paste, Lead-Free Soldering Paste, BGA PCB SMD SMT Flux, No-Clean Solder Paste, Electronic Repair Tin Paste, PCB Repair Flux Paste, Mobile Phone Motherboard Repair Solder Paste, Laptop IC Chip Repair Welding Paste, SMD SMT Assembly Tin Paste, BGA Rework Solder Paste

Feature 2: High Activity, Good Flow, Fast Melting, Low Residue, Less Smoke, Fine Particles, Stable Performance, Easy Dispensing, Good Printability

Feature 3: Strong Mechanical Strength, Reliable Solder Joint, Good Electrical Conductivity, High Temperature Resistance, Oxidation Resistance, Durable Welding Effect

Feature 4: Suitable for BGA, Suitable for PCB, Suitable for SMD, Suitable for SMT, Suitable for IC Repair, Suitable for Motherboard Repair, Suitable for Precision Soldering

Feature 5: No-Clean Flux, Lead-Free Welding, Professional Repair, Electronic Maintenance, DIY Repair, Accurate Application, Smooth Welding, Clean Finish

Feature 6: BGA Welding, BGA Rework, BGA Repair, IC Chip Welding, IC Repair, Chip Soldering, Chip Reballing, Motherboard Maintenance

Function: Strong Mechanical Strength, High Reliability, Good Conductivity, Durable Solder Joint, Stable Performance, Better Solderability

High-concerned chemical: none

Main Keywords: SAC305 Solder Paste, SAC0307 Solder Paste, Solder Paste Welding Tin, Lead-Free Soldering Paste, No-Clean Solder Paste, BGA Welding Paste, PCB Repair Solder Paste, SMD SMT Solder Paste, Flux Tin Paste, Electronic Repair Solder Paste

Material: Tin, Silver, Copper, Sn, Ag, Cu, Lead-Free Alloy, Solder Alloy, Flux Paste, Tin Alloy, Solder Powder, No-Clean Flux

Model 1: SAC305, Sn96.5Ag3.0Cu0.5, Sn96.5 Ag3.0 Cu0.5, 96.5Sn 3.0Ag 0.5Cu, Lead-Free SAC305, SAC305 Solder Paste

Model 2: SAC0307, Sn99Ag0.3Cu0.7, Sn99 Ag0.3 Cu0.7, 99Sn 0.3Ag 0.7Cu, Low Silver Solder Paste, SAC0307 Solder Paste

Model Number: Solder Paste Welding Tin Sn99Ag0.3Cu0.7 Sn96.5Ag3.0Cu0.5

Origin: Mainland China

Package Type: Syringe, Tube, Paste Tube, Tin Paste Syringe, Solder Paste Syringe, Flux Syringe, Needle Bottle, Repair Paste Tube

Particle Size: 25-48μm

Product Name: SAC305 Solder Paste Welding Tin Sn99Ag0.3Cu0.7 Sn96.5Ag3.0Cu0.5 BGA Welding PCB SMD SMT Flux Lead-Free Soldering Repair No-clean

Product Type: Solder Paste, Tin Paste, Welding Tin Paste, Soldering Paste, Lead-Free Solder Paste, No-Clean Solder Paste, Flux Solder Paste, SMT Solder Paste, SMD Solder Paste, BGA Solder Paste, PCB Repair Paste

Quality: High Quality, Professional Grade, Stable Quality, Reliable Performance, Factory Direct, Strict Quality Control, Electronics Grade, Repair Grade

Recommended Uses For Product: PCB, BGA, SMD, SMT, IC Chip, Motherboard, Mobile Phone Board, Laptop Board, Circuit Board, LED Board, Electronic Component, Connector, Tin Pad, Solder Joint

Support: Dropshipping, Retail, Wholesale, Bulk Order, OEM, ODM, Factory Supply, Fast Shipping, Direct Shipping, Online Order, Small Order, Large Quantity Order

Tipo 1: Pate a Souder, Pate d'Etain, Pate de Soudure, Pate a Souder Sans Plomb, Pate a Souder No Clean, Flux de Soudure

Tipo 2: Pasta de Soldadura para PCB, Pasta de Soldadura para BGA, Pasta de Soldadura para SMD, Pasta de Soldadura para SMT

Usage Tools: Soldering Iron, Hot Air Gun, Rework Station, Reflow Oven, Heating Platform, Syringe, Needle Tip, Stencil, Scraper, Dispenser

semi_Choice: yes

Difference Between Sn96.5Ag3.0Cu0.5(SAC305) and Sn99Ag0.3Cu0.7(SAC0307)

Sn96.5Ag3.0Cu0.5 is commonly known as SAC305. It contains 96.5% tin, 3.0% silver, and 0.5% copper. It has higher silver content, better wetting performance, stronger solder joint reliability, and better mechanical strength. It is recommended for BGA repair, PCB assembly, SMD/SMT soldering, and professional electronic repair.

Sn99Ag0.3Cu0.7 is commonly known as SAC0307. It has lower silver content and is a more cost-effective lead-free solder paste. It is suitable for general PCB repair, daily electronic maintenance, and standard soldering applications.

Function of NC-559-ASM Flux

NC-559-ASM flux helps improve solder flow, reduce oxidation, enhance wetting, and make solder joints smoother and cleaner. It is useful for BGA rework, PCB repair, SMD/SMT soldering, IC chip repair, phone repair, and motherboard maintenance.

For better reliability and stronger solder joints, SAC305 is recommended. For general repair and lower cost, SAC0307 is a practical choice.

Option 1: Sn96.5Ag3.0Cu0.5 / SAC305

Recommended for:
High-quality PCB assembly
SMD and SMT soldering
BGA rework and chip repair
Electronic maintenance requiring stronger solder joints
Professional repair shops
Applications that need better reliability and performance

Option 2: Sn99Ag0.3Cu0.7 / SAC0307

Recommended for:
General PCB repair
Standard electronic soldering
Daily maintenance work
Cost-sensitive production or repair
DIY electronics projects
Applications that do not require the highest solder joint strength

Why Choose Our Solder Paste?

Designed for PCB, SMD, SMT, and BGA applications
Lead-free and no-clean soldering paste
Smooth paste texture for easy application
Good solderability and reliable welding effect
Suitable for professional and DIY use
Works well for mobile phone, laptop, motherboard, and circuit board repair
Helps achieve clean, smooth, and stable solder joints
Suitable for precision electronic repair and maintenance

How to Use

1. Clean the PCB pads or soldering area before use.

2. Apply a suitable amount of solder paste to the pads or component pins.

3. Place the SMD component, IC, or BGA part in the correct position.

4. Heat with a hot air gun, soldering station, reflow oven, or suitable soldering tool.

5. Wait for the solder paste to melt and form a smooth solder joint.

6. Allow the solder joint to cool naturally.

7. Check the soldering result and clean the area if needed.

Usage Tips

Use only a suitable amount of solder paste. Too much paste may cause solder bridges.
Keep the soldering area clean for better wetting performance.
For small SMD components and fine-pitch ICs, use a fine needle tip or stencil for more accurate application.
Close the cap tightly after use to avoid drying.
Store in a cool and dry place.
For best performance, avoid long exposure to air before soldering.
SAC305 is recommended when stronger solder joints and better reliability are required.

Frequently Asked Questions

Q: What is the difference between Sn96.5Ag3.0Cu0.5 and Sn99Ag0.3Cu0.7?

A: Sn96.5Ag3.0Cu0.5 is SAC305 solder paste. It has higher silver content and usually provides better wetting, stronger solder joint reliability, and better mechanical strength. Sn99Ag0.3Cu0.7 is SAC0307 solder paste. It has lower silver content and is a more cost-focused option for general soldering work.

Q: Must I clean the board after welding?

A: Adopt no-clean flux formula, no cleaning required for most conventional usage; only need slight cleaning for high-insulation precision medical electronic PCB special scenarios.

Q: Is this a no-clean solder paste?

A: Yes. It uses a no-clean flux formula, which helps reduce residue and makes it convenient for repair work. However, for high-precision repair or professional requirements, cleaning after soldering can still be done if needed.

Q: Can I use it for SMD and SMT work?

A: Yes. This solder paste is suitable for SMD components and SMT assembly or repair. It can be used on PCB boards, IC chips, small components, and fine solder pads.

Q: Can beginners use it?

A: Yes. It is suitable for both professional technicians and DIY users. Beginners should use a small amount first and control heating time and temperature carefully.

Q: What tools can be used with this solder paste?

A: It can be used with hot air rework stations, soldering irons, reflow ovens, heating platforms, syringes, needle tips, stencils, and manual dispensing tools.

SAC305 Lead-Free No-Clean Solder Paste Sn99Ag0.3Cu0.7 Sn96.5Ag3.0Cu0.5 SMT SMD BGA PCB Welding Repair Flux Product Overview This professional-grade SAC305 series lead-free solder paste is customized for industrial SMT mass production, SMD manual welding, precision BGA reballing, PCB circuit board maintenance and electronic repair work. We provide two mainstream alloy formulas to match different welding temperature requirements, board durability standards and industrial production standards: standard Sn96.5Ag3.0Cu0.5 SAC305 high silver solder paste and low silver Sn99Ag0.3Cu0.7 cost-effective solder paste. Adopting upgraded no-clean flux formula, this solder paste meets global lead-free environmental protection standards, eliminates post-welding cleaning procedures, reduces production labor cost, avoids PCB pad damage caused by chemical cleaning solvent, and delivers stable welding performance for long-term electronic assembly and aftermarket repair scenarios. It is universally compatible with automatic SMT stencil printing, manual dispensing, BGA rework station hot air welding and bench soldering operation, suitable for consumer electronics, automotive electronics, communication equipment, industrial control PCB and precision chip packaging welding projects. Core Alloy Specification & Melting Parameter We support two optional alloy compositions to meet diverse production and repair demands, with strict metal powder grading and uniform flux mixing, no powder precipitation, no flux stratification during long-term storage: 1. Sn96.5Ag3.0Cu0.5 Classic SAC305 Formula Alloy Ratio: 96.5% Tin + 3.0% Silver + 0.5% Copper Melting Point: 217℃-220℃ Feature: High silver content, superior anti-oxidation capacity, ultra-low void rate, excellent wetting performance on gold-plated pads, copper pads and nickel-plated substrates, ideal for high-precision BGA chip welding, automotive grade PCB and high-reliability electronic component assembly, resistant to high temperature working environment and thermal cycling aging. 2. Sn99Ag0.3Cu0.7 Low Silver Lead-Free Formula Alloy Ratio: 99% Tin + 0.3% Silver + 0.7% Copper Melting Point: 225℃-227℃ Feature: Cost optimized formula, stable solder joint hardness, strong anti-crack performance, moderate melting temperature, lower raw material cost, perfect for daily SMD batch welding, household electronic repair, ordinary PCB board soldering and small-batch factory production, balance welding quality and procurement budget perfectly. Exclusive No-Clean Flux Advantages, Upgrade Welding Efficiency Different from ordinary water-wash and rosin cleaning-type solder paste on the market, this series adopts modified halogen-free no-clean flux system, which is developed for global electronic welding process standard, solving multiple pain points of traditional solder paste: First, transparent inert residual flux after reflow welding. The residual layer is thin, non-corrosive, non-conductive, non-hygroscopic, will not cause short circuit, leakage current or pad oxidation on finished PCB boards, no need alcohol cleaning, ultrasonic cleaning or solvent cleaning after welding, cutting 30% working time for repair workers and assembly workers greatly. Second, high activity anti-dry flux formula. It maintains stable viscosity in 18℃-25℃ room temperature working environment, no rapid drying on stencil, no plugging mesh holes during SMT printing, long stencil service life, good thixotropy, easy shaping for tiny 0201, 0402 SMD component pad printing and spot welding. Third, halogen-free and corrosion-free material. The flux does not contain harmful halogen components, will not erode PCB copper foil, component pins and BGA ball pads, effectively extend the service life of welded electronic products, pass RoHS, REACH lead-free environmental certification, compliant for EU, North America and global market export electronic products. Key Welding Performance Highlights For SMT SMD BGA PCB Application 1. Ultra High Wetting Ability: Fine spherical tin powder with 25-45μm particle size, uniform particle distribution, fast spreading on various metal pads, firm combination between solder alloy and substrate, firm solder joint adhesion, effectively avoid virtual welding, cold welding, tin bead and tin bridging common welding defects, greatly reduce product rework rate for factory production. 2. Stable Anti-Oxidation Performance: Added special antioxidant additives inside the paste, slow down surface tin oxidation during heating reflow, reduce oxidized tin slag generation, keep solder joint bright and full after molding, uniform solder joint gloss, beautiful finished welding effect, meet high appearance requirement of precision electronic products. 3. Low Void Rate Welding Structure: Optimized alloy shrinkage ratio after cooling, compact internal solder joint structure, low bubble void inside BGA solder ball, enhance thermal conductivity of chip welding position, guarantee stable heat dissipation of CPU, GPU, communication IC chips, avoid chip failure caused by poor heat conduction. 4. Wide Process Operation Window: Adapt to conventional hot air reflow oven, infrared reflow equipment, manual hot air gun, constant temperature soldering iron multiple heating modes, allow reasonable reflow temperature deviation, low requirement for welding equipment, friendly for factory automated production and personal maintenance beginners. 5. Strong Solder Joint Mechanical Toughness: The formed solder joint has anti-vibration, anti-drop and anti-thermal expansion performance, suitable for vibrating working scenarios such as vehicle-mounted PCB, industrial control equipment, wearable electronic devices, not easy to crack or fall off under long-term temperature change. Wide Compatible Application Scenarios Industrial Batch Production: Full automatic SMT production line PCB board reflow soldering, mass SMD resistor, capacitor, diode patch welding, electronic finished product assembly factory supporting materials. Precision Chip Rework: BGA reballing, CPU/GPU chip disassembly and soldering, motherboard north-south bridge chip repair, mobile phone mainboard precision pad welding, integrated circuit packaging repair. Daily Electronic Maintenance: Household circuit board repair, digital equipment welding, home appliance PCB maintenance, laboratory electronic prototype welding, electronic enthusiast DIY production. Applicable Material Substrate: Copper PCB board, aluminum substrate, ceramic substrate, gold-plated circuit board, tin-sprayed pad, nickel-plated component pin welding, compatible with all mainstream circuit board materials on the market. Product Storage & Operation Guidance Refrigeration Storage Suggestion: For long-term stock preservation, store sealed solder paste at 2℃-8℃ refrigeration environment, valid storage period up to 6 months without performance attenuation. Room temperature unsealed use period is 24 hours under 20℃ constant temperature environment. Pre-use Operation: Take out the solder paste and place it at room temperature for 20-30 minutes to restore normal temperature, stir evenly for 3-5 minutes before use, ensure flux and tin powder fully mixed to achieve optimal printing and welding effect. Temperature Matching Advice: Choose Sn96.5Ag3.0Cu0.5 for high-precision high-reliability welding; choose Sn99Ag0.3Cu0.7 for cost-sensitive ordinary batch welding and daily repair work to maximize cost performance. Why Choose Our SAC305 Lead-Free Solder Paste 1. Double Formula Optional: Cover high-end precision welding and economical conventional welding two demands, one-stop purchase for different workshop and repair usage scenarios, no need to find multiple suppliers for different solder paste types. 2. Factory Direct Supply: Direct sales from professional solder material manufacturing factory, no middle dealer markup, stable batch quality, consistent viscosity and alloy composition for each batch, avoid unstable welding effect caused by batch difference. 3. Strict Quality Inspection: Every batch finished solder paste passes metal composition test, viscosity test, reflow performance test and corrosion resistance test, reject defective stratification, oxidation, impure tin powder products, qualified rate up to 99.8%. 4. Cross-Border Professional Packaging: Adopt sealed anti-oxidation tank packaging, equipped with shockproof foam outer package, avoid paste leakage, extrusion and temperature change damage during international long-distance logistics transportation, intact goods arrival rate guaranteed. 5. Professional After-Sales Support: Provide professional welding parameter guidance, reflow temperature curve reference, usage troubleshooting service. If you receive damaged goods or unqualified products, support free replacement and refund quickly, reduce buyer procurement risk. 6. Full Keyword Matching Design: Professionally developed for SAC305, Solder Paste, Welding Tin, Sn99Ag0.3Cu0.7, Sn96.5Ag3.0Cu0.5, BGA Welding, PCB, SMD, SMT, Flux, Lead-Free Soldering, Repair, No-clean core search words, easy to search for global industrial buyers, maintenance workers, electronic processing merchants. Buyer Common FAQ Q1: Is this solder paste completely lead-free? A: Both two alloys are 100% lead-free composition, meet international lead-free electronic manufacturing standards, support export finished products to worldwide countries. Q2: Must I clean the board after welding? A: Adopt no-clean flux formula, no cleaning required for most conventional usage; only need slight cleaning for high-insulation precision medical electronic PCB special scenarios. Q3: Can it work for manual BGA reballing? A: Fully applicable, moderate viscosity not easy to flow, easy to apply tin evenly on BGA stencil, ideal for manual rework station daily chip reballing operation. Q4: What is the difference between the two solder paste models? A: Sn96.5Ag3.0Cu0.5 has higher silver content, better stability for high-end chips; Sn99Ag0.3Cu0.7 is more cost-effective for regular repair and mass patch production.