SPECIFICATIONS

1.Product Name: Solder Paste

Description

Usage: Used for products with certain SMT processes or high temperature resistance

Flux:Lead free and halogen-free, with no resistance value, suitable for mobile phone repair, precision component repair, etc

2.

Primary Composition: Type: Sn99Ag0.3Cu0.7 (Tin-Silver-Copper Alloy)

3.

Melting Point: 217°C

4.

Particle Size: MESH: 20-38μm

Product Characteristics

1.

Physical Properties:

•

Creamy paste texture

•

Maintains moisture without drying out

•

Excellent squeezability and workability

2.

Packaging Design:

•

Green tubular packaging with red cap

•

Features a specialised needle tip for precise application

•

Includes detailed illustrated usage instructions

Applications

1.

Electronics Repair: For chip repair on electronic devices such as mobile phones and computer motherboards (e.g., solder ball operations)

2.

Circuit Board Soldering: Suitable for precision component soldering and rework

3.

Electrical Appliance Repair: Maintenance and assembly of various electronic devices

Usage Method

Following the illustrated guide, the correct procedure comprises:

1.

Unscrew the tube cap counterclockwise

2.

Screw on the specialised needle tip clockwise

3.

Open the base cap

4.

Attach the nozzle for immediate use

Quality Assurance

The product complies with relevant industry standards, is suitable for precision electronic soldering tasks, and ensures soldering quality and reliability.