SPECIFICATIONS

• 1 Gigaohm (GΩ) = 1,000 Megaohms (MΩ) = 1,000,000 Kiloohms (KΩ) = 1,000,000,000 Ohms (Ω)
• 1 Megaohm (MΩ) = 0.001 Gigaohm (GΩ) = 1,000 Kiloohms (KΩ) = 1,000,000 Ohms (Ω)
• 1 Kiloohm (KΩ) = 0.000001 Gigaohm (GΩ) = 0.001 Megaohm (MΩ) = 1,000 Ohms (Ω)

Main Inspection Items, Test Methods, and Performance Requirements

Inspection Items:

• Resistance Temperature Coefficient
• Solderability
• Resistance to Soldering Heat
• Steady State Damp Heat
• Rapid Change of Temperature
• Vibration
• Long-term Load
• Lead Strength
• Power Reduction

Performance Requirements:

• Resistance Temperature Coefficient: ≤±200(x10^-6/°C)
• Solderability: The solder must freely flow and wet the leads.
• Resistance to Soldering Heat: ΔR≤±(0.5%R+0.052)
• Steady State Damp Heat: ΔR≤±(2%R+0.12)
• Rapid Change of Temperature: ΔR≤±(1%R+0.052)
• Vibration: ΔR≤±(1%R+0.052)
• Long-term Load: ΔR≤±(5%R+0.050)
• Lead Strength: ΔR≤±(0.5%R+0.052)
• Power Reduction: <210°C

Test Methods:

• Resistance Temperature Coefficient: -55°C/+20°C to 20°C/+155°C
• Solderability: 235±5°C for 2±0.5s
• Resistance to Soldering Heat: 260+5°C for 10+1s
• Steady State Damp Heat: +40±2°C with 95~98% humidity for 240h
• Rapid Change of Temperature: -55°C/+125°C, 5 cycles
• Vibration: 10~500Hz, 98m/s^2
• Long-term Load: +40±2°C at VR for 1000h
• Lead Strength: 10N, bent twice
• Power Reduction: When the ambient temperature reaches 300°C, the resistor can reduce the load from rated power to 0.
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