FEHONDA TG-8 Thermal Paste 8.5W/m.K High Performance Thermal Grease Thermal Conductive Silicone Grease for Game CPU GPU Cooling

FEHONDA TG-8 Thermal Paste 8.5W/m.K High Performance Thermal Grease Thermal Conductive Silicone Grease for Game CPU GPU Cooling

$381.64

$381.64 $0.00

Color 300g 200g 50g 150g 100g

Description

SPECIFICATIONS

Brand Name: FEHONDA

Choice: yes

Color of thermal conductive gel: Grey

Density(g/cc): 2.7(±0.2)

High-concerned chemical: none

Main Raw Material: Silicone

Material: others

Model Number: TG-8

Origin: Mainland China

Temperature tolerance range (℃): -40~180℃

Thermal Conductivity: 8.5

Thermal Gel Capacity: 50g/100g/150g/200g/300g

Thermal conductivity: 8.5W/m.K

Thickness: 0.1

Type: Thermal Grease

Usage: Heat sink, CPU, LED, GPU,IC and more

Viscosity(mPas): 100~120(*10*3)

Volume: 300

Weight: 50g/100g/150g/200g/300g

breakdown voltage(kv/mm): >10

semi_Choice: yes

FEHONDA TG-8 Thermal Grease (8.5W/m.K) – Professional Heat Dissipation Solution for Electronics

What Makes FEHONDA TG-8 Thermal Compound Stand Out?

As a high-performance heat transfer medium, FEHONDA TG-8 thermal grease is engineered to solve overheating issues in electronic devices. It integrates outstanding thermal conductivity, smooth lubricity, and reliable electrical insulation—a multi-functional solution for stable heat management.

Core Features:

✅ 8.5W/m.K High Thermal Conductivity: Rapidly transfers heat from high-heat components to coolers, preventing overheating and performance throttling.

✅ Wide Temperature Resistance: Performs stably in extreme environments (-40°C to 150°C), suitable for long-term use in harsh industrial or consumer electronics scenarios.

✅ Low Viscosity & Easy Application: Its low consistency supports flexible application methods (dispensing, printing, spreading) – ideal for small/zero-gap thermal contact in compact devices.

✅ Ultra-Thin Application: Works with the minimum usable thickness among thermal products, maximizing heat transfer efficiency in tight-fit setups.

✅ Long-Lasting Reliability: Maintains thermal performance over time, reducing component wear and extending the lifespan of your electronics.

Use Cases:

Perfect for CPUs, GPUs, industrial control motherboards, communication equipment, consumer electronics, and high-heat components—especially in precision, high-density device assemblies.