KELLYSHUN Solder Paste, Leaded Syringe Welding Paste, for Soldering BGA LED SMD Containing Silver Sn63 Electronics Tin Paste

KELLYSHUN Solder Paste, Leaded Syringe Welding Paste, for Soldering BGA LED SMD Containing Silver Sn63 Electronics Tin Paste

$21.20

$21.20 $0.00

Color K-735B Sn63 30g K-735B Sn63 50g K-635B Ag0.4 30g K-635B Ag0.4 50g K-635B 50g bot

Description

SPECIFICATIONS

Brand Name: KELLYSHUN

Choice: yes

Does the product contain Bi？: No

High-concerned chemical: none

Origin: Mainland China

Please note when using
You use a hot air gun or soldering iron for heating, and the temperature needs to be higher than the melting point of the product, because there will be heat loss during the heating process. You need to let the solder paste melt quickly, so that the welding effect will be better

Solder Paste Parameters
30g  ：Net Paste Weight About - 22g.
 50g  ：Net Paste Weight About - 42g.
100g ：Net Paste Weight About - 86g.

Model No: K-635B

Ingredient: Sn62.8Pb36.8Ag0.4 Melting point: 180℃
Usage: lead solder paste, strong welding, moderate temperature. Strong tinning, good conductivity, round and bright solder joints. Suitable for mobile phone repair, tail difference welding, BGA tinning, chip-level repair

Model No: K-735B

Ingredient: Sn63Pb37 Melting point: 180℃
Usage: lead solder paste, strong welding, moderate temperature. Strong tinning, bright solder joints. Suitable for computer, dense-foot IC, home appliance chip patch repair