Origin Honeywell PTM7950 0.2/0.25mm Phase Change Pad 8.5W Thermal Pad Laptop/CPU/GPU Heatsink 40x40 20x30 Thermal Paste Grease

Origin Honeywell PTM7950 0.2/0.25mm Phase Change Pad 8.5W Thermal Pad Laptop/CPU/GPU Heatsink 40x40 20x30 Thermal Paste Grease

$20.36

$20.36 $0.00

Color 40x40x0.2mm 20x30x0.25mm 20x30x0.2mm 40x40x0.25mm 80x40x0.25mm 80x40x0.2mm

Description

SPECIFICATIONS

Application: GPU/CPU/PC/Video card/Laptop/SSD/M2/other electronic equipment

Brand Name: LS

Choice: yes

Color: Grey

Density: 2.8 g/cm³

Dimensions: 40x40mm

High-concerned chemical: none

Material: Thermal,others

Model: Origin Honeywell PTM7950

Model Number: PTM7950

Operating temperature range: -40~+150°C

Origin: Mainland China

Original: Yes

Package: PP Sell (Prevent extrusion, damage and deformation)

Product Name: Phase Change Silicone Pad

RGB Support: NO RGB

Thermal Conductivity: 8.5

Thermal Impedance: 0.04°C cm²/W

Thermal conductivity: 8.5w/mk

Thickness: 0.2

Type: Thermal Grease

Weight: 48

semi_Choice: yes

PTM-7950 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost.

PTM-7950, based on a novel polymer PCM system, exhibits excellent interface wetability during typical operating temperature ranges, resulting in extremely low surface contact resistance. Since PTM-7950 comes only in 0.20mm/ 0.25mm (thicker versions are under development) you need to be sure that this thickness is compatible and suitable for the flatness of your package.

PTM-7950 is a proprietary material that provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04˚Ccm2/W @ no shim), making the PTM-7950 series desirable for high performance integrated circuit devices.

Product Use

The material must go through the phase change temperature to exhibit entitlement performance.

THERMAL IMPEDANCE POST RELIABILITY (ASTM E1461)

End of Line 0.04˚C-cm2/W

Bake 150˚C, 1000 h 0.04˚C-cm2/W

Double 85, 1000h 0.04˚C-cm2/W

Temperature Cycling ''B''(-55˚C to +125˚C, 1000 cycles) 0.045˚C-cm2/W

Thermal conductivity

Preparation before test

Standard : ASTM D5470 .

Sample Specification: Diameterφ30*2.0mm, surface is smooth and no damage.

Test Equipment: DRL-V.

Test method

(1) Place the sample between the cold and hot extremes so that the sample is in full contact with the cold and hot extremes;

(2) Set the temperature to 85 and the pressure to 30N;

(3) Press the test button to start the test.

ow the PTM7950 thermal pad works ?

At room temperature, thermal conductive phase change materials remain solid and cannot discharge air from the interface (Picture 1)

As the temperature increases, the phase change thermal conductive material becomes softer and the air at the interface begins to be discharged, and the temperature also begins to decrease (Picture 2)

When the phase change thermal conductive material reaches the phase change temperature(45°C), it becomes liquid and can greatly wet the interface, discharge the air inside the interface, reduce the interface thermal resistance, and transfer heat as much as possible; When the device is in a non working state, the phase change thermal conductive material becomes solid again, but maintains 100% complete wetting of the interface (Picture 3)