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Sn99Ag0.3Cu0.7 Lead-Free Solder Paste, PCB/BGA/SMD Soldering, USB Interface Repair, Soldering, High-Quality Soldering Flux
$16.92
Sale price
$16.92
Regular price
$0.00
Description
SPECIFICATIONS
Brand Name: NONE
Choice: yes
HXP-603: Sn:99%,Ag0.3%,Cu:0.7%
High-concerned chemical: none
Model Number: HXP-603
Origin: Mainland China
Particle Size: 20-38μm
semi_Choice: yes
weight: 10g/35g/55g
HXP-603: Sn:99%,Ag0.3%,Cu:0.7% Melting point: 217℃/422.6℉
The ingredients of the above products are not controlled for rare metals!!!
Lead-free solder paste, the paste is delicate and smooth, and the PCB should be preheated before soldering
Usage: Used for products with certain SMT processes or high temperature resistance

Free Shipping Over $199
- Standard Shipping: Standard Shipping (12–18 Business Days)
- Express Shipping: Expedited Shipping (5–9 Business Days)
- Free Shipping: Orders over $199 qualify automatically
- Tracking: Full tracking number provided for all orders
30-Day Return Policy
- Returns: 30-day hassle-free return window
- Condition: Items must be unused and in original packaging
- Refund: Full refund processed within 3-5 business days
Why Choose Us?
- Factory Direct: ISO/TS 16949 certified manufacturer
- Quality: 100% electrical continuity tested before shipment
- Experience: 15+ years in automotive connector industry
- Support: Professional technical support available
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