SPECIFICATIONS

Feature

Thermal Pads GPU CPU VGA North bridge Cooler Heatsink Thermally Conductive Silicone 3.6 w/m k,100x100mm 0.5mm 1mm 1.5mm 2mm 2.5mm 3mm 5mm
Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces.
Gap thermal silica film can be well filled with the contact surface
use for Control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes ,LED IC SMD DIP and any cooling module needs to be filled and materials for electrical and electronic products.
Soft,good malleability,with a little viscosity.
Strong insulation and Excellent performance.
Provide a mess-free installation, maximum heat conduction and increased cooling.
Reduce the effectiveness of your heatsink and raise the operating temperature of your processor/video card.

Material: conduction silicone
Thermal Conductivity: 3.6(W/M-K)
Continuous Temperature: -40 Celsius degree~200 Celsius degree
Breakdown Voltage: >4KV
Tensile Strength: 180Kgf/cm2
Color: Blue
Size:optional
100 x 100 x 0.5 mm
100 x 100 x 1.0 mm
100 x 100 x 1.5 mm
100 x 100 x 2.0 mm
100 x 100 x 2.5 mm
100 x 100 x 3.0 mm
100 x 100 x 5.0 mm
10 x 10 x 1.0 mm 100pcs
10 x 10 x 2.0 mm 100pcs