SPECIFICATIONS

Product Model: Z‑0002 ZigBee Wireless PA Module

RF Chip: CC2530F256 + CC2591 Carrier Frequency: 2.4 GHz Transmit Power: Programmable up to 21 dBm (2.5 mW) Communication Distance: Up to 800 m line‑of‑sight open‑air distance

Chip Introduction CC2530F256 is a true System‑on‑Chip (SoC) solution for 2.4 GHz IEEE 802.15.4, ZigBee and RF4CE applications. It builds powerful network nodes with very low BOM cost. Combined with TI industry‑leading Z‑Stack ZigBee protocol stack, it delivers a powerful and complete ZigBee solution.

Basic Parameters of Z‑0002 ZigBee Wireless Module

Wireless ZigBee

1. Wireless Standard: IEEE 802.15.4 protocol
2. Frequency Range: 2.405 GHz ~ 2.480 GHz
3. Transmit Power: Programmable up to 21 dBm
4. ZigBee Protocol: Z‑Stack protocol stack
5. Receiver Sensitivity: ‑97 dBm @ 250 kbps
6. Antenna: External 2.4G SMA‑interface antenna
7. Transmission Range: Up to 800 m open‑air line‑of‑sight (PA max output 21 dBm)

PCB Board

1. Layers: 4‑layer PCB
2. Dimension: 36.0 × 25.6 mm
3. Interface: Standard 2.54 mm pin header
4. Material: High‑dielectric‑constant low‑loss RF substrate

Module Hardware Parameters

1. Operating Voltage: 2.0 V ~ 3.6 V
2. Operating Current: Transmit 30 mA @21 dBm; Receive 26 mA (average)
3. Operating Temperature: ‑40 ℃ ~ +85 ℃ (industrial grade)
4. Storage Temperature: ‑40 ℃ ~ +125 ℃
5. Wireless Baud Rate: Up to 250 kbps
6. Resources: All CC2530 I/O pins broken‑out, convenient for secondary development

Package Contents ‑1 × ZigBee PA wireless module ‑1 × 2.4G antenna